Product Introduction
The semiconductor testing chiller is a high-precision temperature control and cooling system specially designed for chip packaging and testing, wafer testing, and reliability burn-in testing. Developed for semiconductor testing equipment with significant thermal load fluctuations, stringent temperature requirements, and cleanroom operating environments, it provides stable and constant-temperature cooling for test systems, probe stations, burn-in ovens, and test sockets. It effectively suppresses heat generated during chip testing, ensures consistency in chip electrical parameter testing, reduces test errors caused by temperature drift, improves chip yield and test data reliability, supports uninterrupted 7×24-hour operation, and is suitable for semiconductor packaging and testing plants, laboratories, and chip R&D institutions.
Working Principle
The unit adopts a compressor-based refrigeration cycle combined with a high-precision PID intelligent temperature control algorithm to precisely exchange heat and control the temperature of the circulating cooling medium. A fully enclosed circulation pipeline delivers the constant-temperature medium to semiconductor testing stations, rapidly removing heat generated by the chips and test equipment while dynamically compensating for changes in thermal load in real time to maintain a constant temperature at the testing station. The equipment is equipped with flow and pressure monitoring modules to continuously monitor the circulation status. Both air-cooled and water-cooled configurations are available to meet installation requirements under different workshop operating conditions.
Key Advantages
✅ Ultra-High Temperature Control Accuracy for Reproducible Test Data The system uses high-precision sensors and an adaptive PID control algorithm. The standard model can achieve temperature control accuracy of ±0.1℃, while customized models can achieve ±0.05℃. It suppresses temperature fluctuations and prevents deviations in chip test results caused by temperature drift, ensuring stable and repeatable test data across every batch of chips.
✅ Clean, Fully Enclosed Circulation System to Eliminate Contamination Risks The circulation piping is made of 304/316L stainless steel, with an optional magnetically driven pump that eliminates the risk of shaft-seal leakage. The fully enclosed circuit reduces medium evaporation and contamination from impurities, making it suitable for semiconductor cleanrooms. It prevents oil contamination and particles from affecting test equipment and chip samples and supports various media, including deionized water, ethylene glycol, and fluorinated fluids.
✅ Low Vibration and Low Noise for Cleanroom Environments The compressor and water pump feature optimized vibration and noise reduction structures, resulting in low operating vibration that does not interfere with precision testing equipment such as probe stations. The low-noise unit meets semiconductor facility environmental requirements and can be installed directly inside cleanrooms.
✅ Intelligent Control System with Equipment Connectivity The color touchscreen PLC control panel provides real-time display of temperature, flow rate, and pressure. The system features comprehensive fault self-diagnosis and multiple safety protections, including water shortage, high/low pressure, overload, and anti-freezing protection. Standard RS485 and Modbus communication interfaces are provided for integration with production-line MES systems, enabling remote monitoring, alarm output, and data acquisition to support automated production lines.
✅ Continuous and Stable Response to Dynamic Thermal Loads Designed for the transient heat fluctuations characteristic of chip testing, the system provides rapid dynamic temperature compensation. It responds quickly to temperature recovery under multi-station sequential testing and sudden load changes, making it suitable for large-scale chip batch burn-in and functional testing applications.
✅ Highly Flexible Customization Air-cooled and water-cooled configurations are available. Cooling capacity, temperature range, independent multi-channel temperature control, and inlet/outlet fluid interface specifications can all be customized. The system supports CE and SEMI standards for export applications and is compatible with international voltage specifications.
Applications
IC chip burn-in testing, functional testing, and reliability testing
Cooling and temperature control for wafer probe stations and testing equipment
High- and low-temperature testing of semiconductor devices, power semiconductors, and optical modules
Semiconductor packaging and testing production lines and chip R&D laboratories
Heat dissipation and temperature control for semiconductor testing fixtures and test sockets
Optional Customization
Standard Accuracy ±0.5℃ / High-Precision Version ±0.1℃ / Ultra-High-Precision Customized Version
Single-Channel, Dual-Channel, and Multi-Channel Independent Temperature Control Models
Air-Cooled / Water-Cooled Configurations
Medium Compatibility: Deionized Water, Ethylene Glycol Solution, Fluorinated Fluids
Wide-Temperature-Range Versions, Explosion-Proof Versions, and CE-Compliant Models for Export
Multiple Alarm Contact Outputs for Integration with Customer Host Computers